Department:  Product Engineering
Section:  Product Eng. NXP Auto
Employment Type:  Permanent
Description: 

What you will be working on

  • Ensuring 1st time yielding silicon, benchmark D0 for baseline and products.
  • Identify & resolve Product, Test & Fab-Process related yield limiters in shortest time possible.
  • Technical interface with Business Lines/customers
  • Driver for yield improvement
  • Resolve product yield, quality and reliability issues
  • Perform pre-tapeout risk assessment and communicate with Business line/Fab on the necessary actions to eliminate/minimize the risk.
  • Work with Customers/Mother Fab on the DfM related issue.
  • Conduct product yield analyses to identify root cause of wafer sort and final test failures
  • Set up fault diagnostic capabilities for yield improvement
  • Work with Business line/customers on product low yield disposition
  • Perform electrical and physical failure analysis to isolate fail location
  • Drive the yield improvement task force

More about you

  • Master/bachelor’s degree in electrical / Electronic Engineering or Science in Physics
  • 2 – 8 years product and/or test engineering, failure analysis or process-integration experience
  • Experience in Fab process, yield engineering or design will be an added advantage
  • In depth knowledge of semiconductor device physics, electrical & electronics engineering fundamentals & wafer fabrication processes
  • Strong analytical & problem-solving skills
  • Good interpersonal and communication skills