Department:
Product Engineering
Section:
Product Eng. NXP Auto
Employment Type:
Permanent
Description:
What you will be working on
- Ensuring 1st time yielding silicon, benchmark D0 for baseline and products.
- Identify & resolve Product, Test & Fab-Process related yield limiters in shortest time possible.
- Technical interface with Business Lines/customers
- Driver for yield improvement
- Resolve product yield, quality and reliability issues
- Perform pre-tapeout risk assessment and communicate with Business line/Fab on the necessary actions to eliminate/minimize the risk.
- Work with Customers/Mother Fab on the DfM related issue.
- Conduct product yield analyses to identify root cause of wafer sort and final test failures
- Set up fault diagnostic capabilities for yield improvement
- Work with Business line/customers on product low yield disposition
- Perform electrical and physical failure analysis to isolate fail location
- Drive the yield improvement task force
More about you
- Master/bachelor’s degree in electrical / Electronic Engineering or Science in Physics
- 2 – 8 years product and/or test engineering, failure analysis or process-integration experience
- Experience in Fab process, yield engineering or design will be an added advantage
- In depth knowledge of semiconductor device physics, electrical & electronics engineering fundamentals & wafer fabrication processes
- Strong analytical & problem-solving skills
- Good interpersonal and communication skills